{"schema_version":1,"experiment_id":"eoa_inverse_innovation_exp09_archetype_breadth150_20260804","research_id":"eoa_inverse_innovation_exp09_light_prior_art_20260804","cell_id":"representation_independent_interface_contract__chemistry_materials","search_lanes":{"direct_problem_and_intervention":{"queries":["temporary wafer bonding material qualification substitution bond debond cleaning residue outgassing standards","temporary bonding material common test vehicle qualification black box supplier independent process envelope"],"source_ids":["SRC1","SRC3"],"no_result_note":"No exact implementation of a versioned, representation-independent behavioral substitution contract was located."},"synonyms_and_historical_terms":{"queries":["temporary wafer support system WSS evaluation test vehicle debond clean residue thermal stability","temporary wafer bonding materials process sequences RTI five materials"],"source_ids":["SRC1","SRC2"],"no_result_note":null},"products_practices_and_standards":{"queries":["SEMI 3D9 guide materials properties 300 mm 3DS-IC wafer stack temporary bond debond abstract","temporary wafer bonding material qualification matrix process compatibility chemical thermal mechanical debond cleaning"],"source_ids":["SRC2","SRC3"],"no_result_note":null},"component_combination":{"queries":["wafer support system material screening test wafer common process flow residue debond comparison","semiconductor material change qualification alternate supplier functional equivalence process change control standard"],"source_ids":["SRC1","SRC4"],"no_result_note":"The component practices were found separately and in partial combinations, but not with explicit representation-hiding, leakage auditing, state/error semantics, and a single substitution rule."}},"sources":[{"source_id":"SRC1","title":"Temporary Wafer Bonding Materials and Processes","publisher":"RTI International","url":"https://www.rti.org/sites/default/files/resources/lueck_rti_wa1_extendedabstract_2012.pdf","source_type":"PRIMARY_RESEARCH","claims_supported":["Four categories of temporary bonding material were evaluated using application test vehicles and sequenced fabrication processes.","Candidate materials behaved differently despite nominal compatibility, including visible carrier-removal residue, adhesive squeeze-out, and differing dicing requirements.","A matrix compared multiple bonding materials against process-sequence compatibility, closely approaching a common behavioral evaluation."]},{"source_id":"SRC2","title":"SEMI 3D9 — Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack","publisher":"SEMI","url":"https://store-us.semi.org/products/3d00900-semi-3d9-guide-for-describing-materials-properties-for-a-300-mm-3ds-ic-wafer-stack","source_type":"OFFICIAL_STANDARD","claims_supported":["SEMI provides a standardized guide for describing and procuring 300 mm 3DS-IC wafer stacks.","The guide recognizes process and functional variation and references standardized metrology for thickness, bow, warp, and flatness.","The guide does not purport to cover all safety issues; users retain responsibility for safety, health, and regulatory determinations."]},{"source_id":"SRC3","title":"Temporary Wafer Bonding Processing Theory","publisher":"Brewer Science","url":"https://www.brewerscience.com/processing-theories/temporary-bonding/","source_type":"FIRST_PARTY_PRODUCT","claims_supported":["Temporary bonding is a coupled sequence comprising coating, bonding, thinning and backside processing, film-frame mounting, debonding, and cleaning.","Material behavior across thermal cycling, stress, processing, release, and cleaning controls wafer-stack stability.","Documented risks include voids, deformation, delamination, difficult residue, feature damage during peeling, and contamination during processing."]},{"source_id":"SRC4","title":"Supplier Product Change Notification","publisher":"Infineon Technologies","url":"https://www.infineon.com/quality/quality-management/supplier-product-change-notification","source_type":"OFFICIAL_GUIDANCE","claims_supported":["Semiconductor material, process, supplier-site, and test-location changes are subject to gated evaluation and release.","Change submissions can require before-and-after comparisons, risk assessment, FMEA and control-plan updates, qualification results, samples, and compliance information.","Technical qualification does not displace applicable standards, regulations, or responsible quality authorities."]}],"problem_evidence":{"status":"PARTLY_SUPPORTED","finding":"The operational problem is visible: primary testing found material-dependent residue, squeeze-out, and dicing behavior within realistic process sequences, while supplier guidance identifies deformation, delamination, residue, and damage risks across bond-process-debond-clean. Semiconductor change-control guidance also treats critical-material and manufacturing-site changes as requiring renewed qualification. The narrower assertion that current qualification is generally dominated by resin identity, solvent composition, or incoming chemical checks rather than behavioral testing was not directly established by the retained sources.","source_ids":["SRC1","SRC3","SRC4"]},"closest_prior_art":[{"name":"RTI multi-material temporary-bonding process-flow evaluation","source_ids":["SRC1"],"overlap":"Uses common application test vehicles and sequenced fabrication challenges to compare chemically and operationally different temporary bonding systems, recording compatibility, release, residue, and process-specific divergences.","remaining_difference":"It is an experimental comparison rather than a versioned supplier-neutral contract: it does not define identical hard invariants, invalid-transition responses, representation leakage audits, or a governed production-substitution rule and canary."},{"name":"SEMI 3D9 standardized wafer-stack description","source_ids":["SRC2"],"overlap":"Standardizes observable descriptions and metrology relevant to procuring and processing wafer stacks despite process and dimensional variation.","remaining_difference":"It describes wafer stacks and metrology, not conformance of alternative temporary-bonding material systems through a complete bond-process-debond-clean sequence."},{"name":"Infineon supplier product/process change control","source_ids":["SRC4"],"overlap":"Provides a gated, documented evaluation-and-release process for material, process, and manufacturing-site changes, including risk assessment, qualification evidence, samples, and compliance review.","remaining_difference":"It is generic semiconductor change governance and does not supply a temporary-bonding behavioral oracle, treat formulation as an opaque implementation, or establish interchangeability within a tested process envelope."},{"name":"Brewer Science temporary-bonding process flow","source_ids":["SRC3"],"overlap":"Treats performance as sequence-dependent across bonding, processing, debonding, and cleaning and names relevant failure mechanisms and side effects.","remaining_difference":"It is supplier-specific technical guidance tied to particular material families and release methods, not a common contract for qualifying substitutes from multiple suppliers."}],"prior_art_disposition":"ADJACENT_PRIOR_ART","contrastive_claim_remaining":"For one fixed wafer stack, tool set, and exposure envelope, a predeclared supplier-neutral contract using the same sequence-wide hard-invariant oracle for incumbent and candidate materials—and excluding formulation identity from acceptance except where safety or compatibility independently requires it—will produce repeatable substitution decisions, reject deliberately invalid runs, and expose consequential supplier-specific dependencies that ordinary product-specific qualification leaves implicit.","contrastive_claim_falsifier":"The claim is falsified if existing qualification records already implement the same formulation-independent sequence contract and leakage audit, or if a candidate repeatedly passes every predeclared invariant yet diverges from the incumbent on a predeclared critical wafer outcome during blinded repetition or the authorized canary. It is also falsified if safe prediction demonstrably requires controlling internal chemical features that the observable contract cannot capture.","gates":{"adequate_source_search":{"status":"PASS","rationale":"All four required lanes were searched. Exactly four opened sources span RTI International, SEMI, Brewer Science, and Infineon and include primary research, an official standard, first-party technical material, and official corporate guidance.","source_ids":["SRC1","SRC2","SRC3","SRC4"]},"supported_problem":{"status":"PASS","rationale":"Sequence-dependent compatibility, residue, deformation, delamination, damage, and material-specific process behavior are directly documented. Formal change governance for material and site changes is also visible, although the claimed prevalence of composition-centered qualification remains only partly supported.","source_ids":["SRC1","SRC3","SRC4"]},"distinct_testable_claim":{"status":"PASS","rationale":"The closest work already compares materials through realistic sequences, but the retained sources do not disclose the full combination of a versioned supplier-neutral contract, hidden formulation, identical hard-invariant oracle, state/error semantics, leakage audit, and bounded substitution rule. That remaining difference has measurable outcomes and explicit falsifiers.","source_ids":["SRC1","SRC2","SRC3","SRC4"]},"bounded_next_test":{"status":"PASS","rationale":"A laboratory comparison limited to one specified stack, the incumbent and one candidate, no more than three exposure sequences, blinded replication, and deliberately invalid controls can test repeatability and oracle sensitivity without authorizing production substitution.","source_ids":["SRC1","SRC3"]},"no_obvious_safety_or_authority_stop":{"status":"PASS","rationale":"The proposed first step is measurement on designated test wafers, preserves quality-authority approval, retains chemical-hazard and regulatory review, and includes stop, quarantine, cleaning, inspection, and incumbent-restoration conditions. SEMI explicitly leaves safety and regulatory responsibility with users, and semiconductor change guidance requires risk, compliance, qualification, and gated release.","source_ids":["SRC2","SRC4"]}},"screen_survival":true,"world_novelty_boundary":"This bounded public-web screen found adjacent prior art and leaves a narrow testable contrast; it cannot establish world novelty, patentability, freedom to operate, market size, expert acceptance, or realized manufacturing value."}