{"schema_version":1,"experiment_id":"eoa_inverse_innovation_exp12_substrate_denial72_20260805","research_id":"eoa_inverse_innovation_exp12_light_screen_20260805","cell_id":"synchronized_release_dampening__chemistry_materials","search_lanes":{"direct_problem_and_intervention":{"queries":["microencapsulated latent curing agent epoxy different activation temperatures capsules staged release","dual microcapsule curing agents epoxy release temperature shell permeability","epoxy cure temperature feedback control thermocouple exotherm ramp hold thick section"],"source_ids":["SRC1","SRC2","SRC3","SRC4"],"no_result_note":"No retained source disclosed the full combination of offset latent-hardener capsule cohorts, deliberately metered capsule release, and response-gated admission of successive activation bands."},"synonyms_and_historical_terms":{"queries":["microcapsule-type latent curing agent epoxy shell thickness activation temperature DSC","one-component epoxy adhesive microcapsule latent curing agent","B-stage dual-cure epoxy different curing temperatures exotherm peaks"],"source_ids":["SRC1","SRC2","SRC3"],"no_result_note":null},"products_practices_and_standards":{"queries":["epoxy thick casting exotherm thermal runaway cure schedule official technical guide","thick laminate cure exotherm dwell thermocouple epoxy","site:astm.org epoxy cure exotherm differential scanning calorimetry standard"],"source_ids":["SRC2","SRC4"],"no_result_note":null},"component_combination":{"queries":["patent epoxy multiple latent curing agents different activation temperatures staged cure","adaptive cure cycle epoxy exotherm feedback thermocouple hold advance temperature patent","online optimisation active control cure process thick composite laminates","controlled release curing agent microcapsule epoxy temperature"],"source_ids":["SRC1","SRC2","SRC3","SRC4"],"no_result_note":null}},"sources":[{"source_id":"SRC1","title":"Synthesis and Properties of Single-component Epoxy Adhesive Containing Microcapsule-type Latent Curing Agent","publisher":"Journal of Materials Engineering","url":"https://jme.biam.ac.cn/EN/abstract/article/1001-4381/7638","source_type":"PRIMARY_RESEARCH","claims_supported":["A thermally latent microencapsulated curing agent can provide a one-component epoxy system with room-temperature shelf life and heat-triggered cure.","The reported 2PZ-PGMA microcapsule system cured at 100 degrees C in 30 minutes and retained shelf life exceeding 50 days at room temperature.","DSC and mechanical testing are established characterization methods for such formulations."]},{"source_id":"SRC2","title":"JPH0627183B2 — Liquid epoxy resin composition","publisher":"Japan Patent Office, accessed through Google Patents","url":"https://patents.google.com/patent/JPH0627183B2/en","source_type":"OTHER","claims_supported":["Microcapsule-type latent curing agents that survive room-temperature mixing and become active above a prescribed heating temperature were known.","The disclosure links capsule-shell thickness to pot life and required curing temperature: excessively thick shells require undesirably high temperatures.","Commercial microcapsule latent-curing products were identified, showing that the underlying capsule architecture was not merely hypothetical."]},{"source_id":"SRC3","title":"US9057002B2 — Curable resin compositions","publisher":"United States Patent and Trademark Office, accessed through Google Patents","url":"https://patents.google.com/patent/US9057002B2/en","source_type":"OTHER","claims_supported":["Epoxy formulations containing two hardeners or curing mechanisms operating at different temperatures were disclosed.","The reactions were thermally decoupled and produced distinct DSC exotherm peaks, with the lower-temperature reaction used for B-staging and the higher-temperature reaction for final cure.","Temperature-separated curing reactions and staged thermal processing therefore predate the proposal, although this source does not use matched capsule cohorts to suppress thick-section exotherm."]},{"source_id":"SRC4","title":"Online optimisation and active control of the cure process of thick composite laminates","publisher":"Journal of Manufacturing Processes; open manuscript hosted by Cranfield University","url":"https://dspace.lib.cranfield.ac.uk/bitstream/1826/19003/1/Cure_process_of_thick_composite_laminates-2023.pdf","source_type":"PRIMARY_RESEARCH","claims_supported":["Thick carbon-fiber/epoxy parts exhibit coupled heat-conduction and cure-exotherm behavior capable of producing thermal gradients and temperature overshoot.","An experimentally validated controller used real-time monitoring and model predictions to accept or reject proposed oven-temperature dwells subject to overshoot constraints.","The reported controller reduced cure duration while limiting overshoot, establishing response-informed staged cure control as prior art independent of capsule cohorting."]}],"problem_evidence":{"status":"PARTLY_SUPPORTED","finding":"The general problem—exothermic epoxy cure in a thick, low-conductivity section producing internal gradients or overshoot—is directly visible, and thermally activated microencapsulated latent curing agents are established. The retained evidence does not directly demonstrate that a narrowly synchronized capsule-opening distribution is itself the cause of a thick-section thermal peak, so that specific causal framing remains unverified.","source_ids":["SRC1","SRC2","SRC4"]},"closest_prior_art":[{"name":"Thermally activated microcapsule latent-curing agents with shell-thickness-dependent activation","source_ids":["SRC1","SRC2"],"overlap":"Provides one-part epoxy latency, heat-triggered release or activation, and a capsule-shell design variable that affects curing temperature.","remaining_difference":"Does not disclose a deliberately blended set of bounded opening-temperature cohorts used to spread a fixed hardener payload and suppress a measured thick-section exotherm."},{"name":"Thermally decoupled dual-cure epoxy composition","source_ids":["SRC3"],"overlap":"Uses multiple hardeners or reaction mechanisms with separated activation temperatures and distinct DSC exotherm peaks, enabling staged thermal processing.","remaining_difference":"The separated reactions serve B-stage and final-cure functions rather than active-equivalent-matched capsule cohorts designed to decorrelate hardener availability while retaining the same endpoint chemistry."},{"name":"Real-time active control of thick epoxy-composite cure","source_ids":["SRC4"],"overlap":"Uses monitored state, candidate dwells, conditional acceptance, and overshoot limits to adapt the oven cycle of a thick epoxy part.","remaining_difference":"It controls ordinary cure kinetics and does not coordinate advancement with independently measured opening of multiple latent-hardener capsule cohorts."}],"prior_art_disposition":"ADJACENT_PRIOR_ART","contrastive_claim_remaining":"At fixed resin chemistry, active equivalents, capsule loading, endpoint conversion, geometry, and bounded cycle duration, deliberately offset capsule-opening cohorts can broaden the independently measured hardener-release distribution before reducing thermal-peak concentration; moreover, measured-response gating of entry into later capsule bands provides benefit beyond a duration-matched fixed-hold schedule. The retained art establishes each major component separately but not this causal integration.","contrastive_claim_falsifier":"Falsify the remaining claim if cohorting does not broaden opening before any thermal change, if broadened opening leaves heat-flow timing and core overshoot unchanged, if later cohorts remain trapped or endpoint conversion becomes nonuniform, or if a duration-matched slow ramp or fixed hold performs equivalently to response-gated advancement.","gates":{"adequate_source_search":{"status":"PASS","rationale":"The screen covered direct phrasing, older latent-curing and B-stage terminology, products and cure practices, patents, and combinations involving capsule activation, distinct-temperature hardeners, thick-part exotherm, and feedback-controlled dwells. Exactly four opened direct sources from multiple publishers were retained, including two primary-research sources.","source_ids":["SRC1","SRC2","SRC3","SRC4"]},"supported_problem":{"status":"PASS","rationale":"Thick-section epoxy exotherm and thermal-gradient behavior are supported, as is heat-triggered microcapsule latency. Evidence for synchronized capsule opening as the specific initiating cause is incomplete, yielding PARTLY_SUPPORTED rather than full support.","source_ids":["SRC1","SRC2","SRC4"]},"distinct_testable_claim":{"status":"PASS","rationale":"The residual claim distinguishes independent capsule-opening timing from intrinsic cure kinetics and distinguishes information-dependent gating from equal-duration fixed holds; both distinctions have observable precedence and explicit falsifiers.","source_ids":["SRC1","SRC2","SRC3","SRC4"]},"bounded_next_test":{"status":"PASS","rationale":"The proposed milligram-scale DSC and small instrumented-coupon comparison is bounded, matched across active equivalents and geometry, includes independent release measurement and rival schedules, and has explicit advancement criteria. The cited work supports DSC characterization and instrumented cure-control trials as feasible methods.","source_ids":["SRC1","SRC4"]},"no_obvious_safety_or_authority_stop":{"status":"PASS","rationale":"Reactive-cure exotherm is a real hazard, but the authorized first step is limited to approved milligram-scale calorimetry and small non-safety-critical coupons with predefined thermal, containment, shutdown, and qualification limits. No retained source reveals an authority prohibition that would prevent that bounded laboratory screen.","source_ids":["SRC4"]}},"screen_survival":true,"world_novelty_boundary":"This bounded four-source screen supports researchability and leaves an adjacent-art contrast for testing. It does not establish world novelty, patentability or freedom to operate, market size, expert acceptance, qualification, realized safety, or realized value; unsearched patents, non-English literature, proprietary formulations, and industrial process records may disclose closer combinations."}